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What is the Open Compute Project (OCP)?

The Open Compute Project (OCP) is a collaborative community, fostered by the OCP Foundation, focused on redesigning hardware technology to efficiently support growing compute infrastructure demands. Its mission is to design, use, and enable the mainstream delivery of the most efficient designs for scalable computing.

Originally publicly launched by Facebook (now Meta) in 2011, OCP began by sharing open designs for hyperscale data center infrastructure. Today, it has grown into a broad ecosystem of operators, OEMs/ODMs, component suppliers, and solution providers working together to develop and adopt open hardware standards.OCP INSPIRED LOGO

 For Dober, we have been recognized as OCP Inspired™ for our COOLWAVE DC-25 coolant solution, a critical step in our data center coolant journey. 

What Does OCP Do?

OCP develops and promotes open specifications and collaborative design practices across data center hardware and infrastructure. These specifications aim to improve efficiency, scalability, and interoperability across the data center ecosystem.

Key areas of focus include:

  • Data center facilities (power, cooling, and operations)
  • Server and storage hardware
  • Networking equipment
  • Rack and power systems
  • Cooling technologies

OCP projects are organized into domain-specific groups where members collaborate on specifications, reference designs, and best practices.

Key OCP Projects Relevant to Data Centers

Data Center Facility Project

The Data Center Facility (DCF) project focuses on the design and operation of data center infrastructure, including power systems, cooling solutions, and facility-level integration. Its scope spans everything from power delivery to cooling architecture and operational considerations.

Rack & Power Project

The Rack & Power project defines standards such as the Open Rack architecture, which supports interoperable rack systems and power distribution across vendors. These designs aim to enable scalable deployment and consistent integration across different hardware providers.

Cooling Environments Project

Cooling is a major area of innovation within OCP. The Cooling Environments project addresses a range of cooling approaches, including:

  • Cold plate liquid cooling n- Coolant distribution units (CDUs)
  • Immersion cooling
  • Rear door heat exchangers
  • Heat reuse strategies

Within this project, the Cold Plate sub-project focuses on standardizing interfaces and requirements for direct liquid cooling systems. OCP-published materials emphasize enabling multi-vendor interoperability and supporting non-proprietary supply chains for liquid cooling technologies.

OCP Inspired™ vs. OCP Accepted

OCP defines different levels of alignment with its specifications:

  • OCP Accepted™: Products that fully comply with an approved OCP specification and have contributed design files.
  • OCP Inspired™: Products that align with OCP concepts or specifications but have not contributed full design materials or undergone full acceptance processes. Dober's COOLWAVE™ DC-25 heat transfer fluid is an example of an OCP Inspired™ solution. 

This framework helps signal how closely a product aligns with OCP specifications while allowing flexibility for broader industry adoption.

Why OCP Matters

OCP’s open approach encourages collaboration and helps expand interoperability across vendors. By promoting shared specifications, OCP contributes to a broader ecosystem where organizations can adopt compatible technologies from multiple suppliers.

This model can support:

  • Greater interoperability across hardware components
  • Expanded supplier ecosystems
  • Increased flexibility in system design and integration

As computing demands increase—particularly with AI and high-density workloads—these collaborative approaches to infrastructure design are becoming increasingly important.

OCP and Liquid Cooling

Liquid cooling is a rapidly evolving area within data centers, and OCP plays a key role in shaping emerging approaches.

Through the Cooling Environments project and Cold Plate sub-project, OCP provides guidance and requirements for liquid cooling implementations. These efforts focus on:

  • Standardizing interfaces and system requirements
  • Supporting interoperable, multi-vendor ecosystems
  • Enabling scalable deployment of liquid cooling technologies

OCP’s work helps align IT hardware and facility infrastructure considerations, including how cooling systems integrate with broader data center operations.

Conclusion

The Open Compute Project is a major force in the evolution of data center infrastructure. By fostering open collaboration and developing shared specifications, OCP helps drive efficiency, scalability, and interoperability across the industry.

For organizations evaluating modern data center technologies — especially in areas like high-density compute and liquid cooling — understanding OCP’s frameworks and projects provides valuable context for navigating an increasingly complex ecosystem.

Learn more about Dober's OCP Inspired COOLWAVE DC-25